A 2 mm Glass-Embedded Fan Out Antenna in Packaging (FO_AiP) for 60 GHz mmWave Applications

To improve radiation performance of a fan-out antenna-in-packaging (FO_AiP), a self-designed, embedded glass with redistribution layers (RDLs) was previously introduced into the FO packaging structure, and the newly aperture-coupled microstrip patch antenna design has been proved to be a suitable design for the 5
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generation (5G) millimeter wave (mmWave) applications. However, the planar dimensions of the early antenna design were relatively large for future devices. In this study, the size of a single glass embedded FO_AiP is minimizing to 2 mm from 3 mm but with compatible electromagnetic (EM) performances. To this end, single factor analysis on the 2 mm FO_AiP was first performed through the ANSYS HFSS software, followed by a consecutive procedure for structure improvements. As a result, a 2 mm FO_AiP model with 5.5 dB gain and 3.96 GHz bandwidth is proposed for 5G applications at 60 GHz.