A Double-sided Cooling SiC Power Module Applied to Electric Vehicles

In this paper, a new double-sided cooling SiC power module is proposed for application in the field of electric vehicles. Based on the mature silver sintering process, a kind of chip is used to design a double-sided thermal packaging structure to simulate and analyze the thermal field and stress of different combinations of new packaging materials, and the optimal combination of packaging materials under high frequency and high power density is studied. The chip was properly arranged, using ANSYS Q3D for stray inductance extraction, and the chip layout was further optimized to reduce stray inductance to less than 7nH.