New Self-Healing Dielectric for High-Reliability, High-Performance PCB-Embedding Materials for Power Electronics Applications

Printed Circuit Board (PCB)-embedded power electronics packages are anticipated as the next major packaging trend to support efficient and reliable electrical energy conversions. With many core aspects of the package being modified, the dielectric is now required to ensure new functions while still assuming its original electrical insulation function. With the expected increase of operational voltages that come with wide bandgap semiconductor components, high-reliability dielectric packaging materials are required. Given the recent breakthrough in polymeric science, self-healing materials based on Covalent Adaptable Networks (CANs) can be applied to highly stressed systems such as integrated power modules, with the aim to improve the reliability of the package. This work proposes a critical evaluation of the compatibility of a CAN to the requirements of the power electronics field and evaluates the recovery efficiency through mechanical and electrical indicators.