Heterogenous Photonic Integration for Quantum Optical Communication

Photonic integrated circuits (PICs) play an important role in telecom and datacom applications. While in the past integrated transceivers were the main driver for technological advances in integrated photonics, nowadays PICs are emerging in various other fields, such as sensing, high-performance computing, quantum technologies, and more [1]. Various material platforms for PICs have been developed and successfully utilized, like III-V semiconductors (InP, GaAs), silicon-based materials (Si, Si
3
N
4
, SiO
2
), lithium niobate (LiNbO
3
), polymers and others.