Ultra-low profile CSPs - new packaging solutions for 300 mm based high-speed, mobile and wireless memory applications

The electronics industry shaped the 90s with exceptional progress in device- and packaging technology. Still the demand continues for lower cost, smaller size and more functionality. The recent deployment of 300 mm wafers, low k dielectrics and copper interconnects are the contribution from the waferfab. The response in the assembly and packaging area are more advanced packages like BGA, CSP, DCA or waferlevel CSP. This paper discusses challenges and solutions for ultra-low profile CSP packages with respect to process control and flexibility of a leading 300 mm die bonder. Challenges will be discussed for film based BOC (board on chip) and stacked die CSPs with both types of interposer between dice, epoxy and tape.