Integral Equation-Based Solver for the Simulation of Integrated Circuit Packages

A full wave simulation using an integral equation-based solver on the IEEE plasma package benchmark problem [1] is performed. The integral equation approach offers advantages over traditional Finite-Element Method (FEM) solvers, as it uses a surface-based mesh and shows excellent efficiency for large-scale structures like IC packages. With its large amount of geometries, The benchmark is used as a test case to validate the full wave solvers on integrated circuits