A Compact Band1-3 Quadplexer using a novel Surface Acoustic Wave Technology

There are several filter technologies based on acoustic properties. Low-cost, low- performance filters tend to be dominated by LT SAWs and high cost, high performance filters are dominated by FBAR and IHP (POI surface wave devices). In between are Temperature Compensated SAWs (TCSAWs). Adding to this retinue of technologies are bonded LT to SAWs (the LT is 5 to 20 um thick) where, in our case, the LT/SI interface is apodized to eliminate parasitic bulk modes. This technology coupled with an aggressive polymer-based wafer-scale package allows for integration of the band1 and band3 duplexers into a single die quadplexer that is~2mm
²
in area and can easily fit into a 2.0 X 1.6 mm
²
package.