High Efficient Methods to Enhance the Noise Isolation Performance of Partitioned Ground Plane

Novel structures of partitioning the ground plane in multi-layer printed circuit board (PCB) are proposed to enhance the noise isolation performance. Two methods are proposed in this paper. The first method is embedding two arrays of high dielectric constant (DK) dielectric cylinders in the substrate near the etched slot, and the second method is modifying the bridge structure. Simulation analysis was conducted in the frequency range of 0.1~5 GHz. The research results demonstrate that the embedded high DK dielectric cylinders can achieve -40 dB noise suppression within the 1~4.5 GHz frequency range, and the method of combining the modified bridge method and high DK dielectric cylinders can suppress noise up to -70 dB within 1~5 GHz. The obtained results also show that modifying the bridge structure can only improve the noise isolation performance by 10 dB, so the coupling interference from the slot is very serious.