SPICE-based model validation for 1200V AcepackTM Drive traction power module

The main aim of this work is to present the electrical analysis of the Acepack
^TM
Drive housing an half bridge configuration with 8 SiC MOSFET per switch. The analysis is performed by means of SPICE model simulation setup and the results have been compared with experimental measurements. The experimentally validated simulation model can be exploited to investigate the electrical behavior of the power module in a wider operating range, by considering different working conditions and applications.