The Research of Reliability Measures of Thin Film Resistors on an Extended Temperature Range of Operation

This scientific article focuses on the study of the influence of low ambient temperatures ranging from -55°C to +125°C on the reliability measures of thin-film resistors when used in radio-electronic systems. A review and analysis of dependability handbooks, as well as scientific works by renowned authors in the field, were conducted. Mathematical models for evaluating the reliability measures and their physical characteristics were analyzed. Based on theoretical and analytical research, an improved mathematical model for assessing the operational failure rate of thin-film resistors as the primary reliability measure and mode coefficient was developed. To validate the proposed mathematical models, a validation process is suggested, based on data that can be obtained through real accelerated test of thin-film resistors for reliability. To achieve this, a testing methodology in the form of a test profile and a hardware-software implementation of a complex for automated testing are proposed in this article. Accelerating factors that influence the degradation processes of thin-film resistors, necessary for conducting accelerated test to confirm their dependability, are identified. These accelerating factors should be applied collectively during the test cycles in order to reduce the testing duration and enhance their reliability.