Evaluation of Embeddable FANTASTIC BCI-ROMs as Compact Thermal Models in Electronic Cooling applications

System integrators rely on semiconductor vendors to provide thermal models of their products so that in-situ thermal performance can be simulated during the design process. Currently, this provision of models is impeded in several ways. Calibrated detailed thermal models, while representing the pinnacle of accuracy, are seldom available due to intellectual property protection concerns, and when they are, the level of detail included is computationally expensive to include in 3D Computational Fluid Dynamics (CFD) simulations. Compact thermal models are standardized
^{1, 2}
and widely available, however these are mostly obsolete as they do not support transient applications and they do not support multiple die packages. System integrators must then resort to creating approximate detailed models which is time consuming and adds unquantified uncertainty to the results. This paper will introduce a method to solve these problems and enable the thermal model supply chain for packages by embedding a boundary condition independent reduced order model (BCI-ROM) in a 3D CFD thermal simulation tool.