Statistical Analysis of the Influence of the Amount of Bismuth in a Combined Solder Paste Footprint on the Content of Voids in the Solder

The article describes the study and the results of soldering with mixed two solder pastes - standard and low temperature in a combined footprint. The combined footprint was made by jet printer with a SAC305 and 58Bi42Sn pastes. The experiments were carried out with a different ratio between the standard and low-temperature pastes. It was measured whether changing the amount of bismuth in the solder paste changed the amount of voids in the component solders. Standard electronic components were examined and analyzed to obtain an objective statistical analysis.