Research on Integrated Circuit Heat Dissipation Packaging Method Considering the Distribution of Thermal Characteristics

As the power and integration of integrated circuits increase, the thermal power consumption per unit area of internal chips, power components, circuit boards and other electronic devices keeps rising. As a result, the hot spot temperature of integrated circuits becomes higher and higher, and the thermal characteristics become increasingly prominent. Therefore, in order to effectively test the thermal characteristics of integrated circuits and optimize the topology structure, this paper took a laptop motherboard as the simulation analysis object, built an integrated circuit simulation model, simulated and analyzed the thermal characteristics of the circuit motherboard under different working conditions, and compared the influence of different types and positions of finned radiators on the temperature of the circuit based on the hot spot temperature. The experimental results show that the needle-fin radiator has better heat dissipation effect than the flake fin radiator. It is necessary to solve the heat dissipation problem by adopting reasonable packaging method.