On-Chip Current-Mode Communication Circuits for Stackable Li-ion Battery Management System Using 0.18μm BCD HV Process

This paper proposes three types of Current-Mode Communication Circuits for stackable Li-ion Battery Management System (BMS). Type 1 Current-Mode Communication Circuit is to transmit the analog signal from the BMS chip above to below. Type 2 and Type 3 Current-Mode Communication Circuits are to transmit the digital signal from the BMS chip below to above and from the BMS chip above to below, respectively. With the proposed on-chip design, the additional off-chip components are not required for the communication between the stacked Li-ion BMS chips. Besides, the edge detection circuit is employed to reduce the delay time of the Type 2 and Type 3 Current-Mode Communication Circuits at all process and temperature corners. The proposed design is implemented with a 0.18 $\mu$m BCD HV process. The core area is 643. 47× 839.585$\mu \mathrm{m}^{2}$. The operation frequency of the Type 3 Current-Mode Communication Circuit is up to 10 MHz. The power-delay-products (PDPs) of the Type 2 and the Type 3 Current-Mode Communication Circuits are 25.246 pJ and 30.019 pJ, respectively.