Efficient Transient Thermal Simulation of 2.5-D Chiplet-Based Packages by Laguerre-Based Spectral-Element Method

In this paper, an efficient approach named Laguerre-based spectral element method (LBSEM) is proposed for transient thermal analysis of 2.5-D chiplet-based packages. This algorithm is a marching-on-in-order strategy that is unconditionally stable, which uses weighted Laguerre polynomials (WLPs) as basis functions and the Galerkin testing process to eliminate the thermal field's temporal variables. In the spatial domain, the spectral element method (SEM) is employed to compute Laguerre coefficients. The efficiency and accuracy of the proposed approach are verified by analyzing transient heat behavior of a typical 2.5-D chiplet package.