Robust Image Processing Software for Void Calculation in Thermal Interface Materials

Heat sink coupled with highly conductive thermal interface material (TIM) is a vital thermal solution for heat dissipation in high-performance microprocessors. During the lid attachment process, void formation is inevitable due to flux application. This paper describes the use of a robust software to effectively quantify TIM voids in high-performance microprocessors, following inspection using Acoustic and X-ray Laminography imaging. Case studies results demonstrated significant reduction in analyst and system variation and the ability to achieve accurate void detection consistently with this single unified software.