Evaluation on AutoTEM5 Software For Automated TEM Sample Preparation In Semiconductor Failure Analysis

Transmission electron microscope (TEM) failure analysis has been widely adopted in semiconductor manufacturing due to its ability to provide (sub)nanometer scale resolution for structure profiling, measurement, and defect characterization. However, TEM sample preparation using focused-ion beam milling can be challenging and time-consuming, which usually requires highly skilled personnel. With the advancement in software-assisted automation, TEM sample preparation has become more efficient and flexible. In this work, we evaluated the recently launched AutoTEM™ 5 software from ThermoFisher Scientific. This software provides a more user-friendly and easy-to-control workflow compared to previous versions. Other than the standard ex-situ lift-out procedure, it also enables guided automation for in-situ lift-out and inverted backside milling, making the operation more effective for users of different skill levels. Although challenges still exist in fully applying automation for all types of structures and situations, we propose a solution to maximize the benefits from automation for non-critical milling steps and/or (embedded) site-specific structures.