Single Factor Study of Solder Joint Reliability for MCP Packages

In this paper, the research aims to target on solder joint reliability (SJR) of multi-chip packages (MCPs) with respect to 10 critical factors effect. Oftentimes, all factors are implemented together to obtain the best result, lacking in empirical data collection by varying each factor. In this study, the Weibull analysis will be conducted, and the first failure will be further investigated to understand which factor results in the optimum reliability performance. Last, a table of each single factors contributing to the percentage of life improvement will be generated for the good of design for reliability (DfR).