In Depth Fault Isolation Using FIB Edit & Micro-probing Method

Focused Ion Beam (FIB) is one the most common use semiconductor analytic tool nowadays. FIB main function includes small area cross section analysis, TEM lamella sample preparation and die level circuit edit. Die level circuit edit using combination of circuit study and both etching & deposition method is important. This approach enables direct accessibility to suspected failure circuit by using micro-probe pad. A method to perform in depth fault isolation using FIB edit and microprobing method that will be presented in this paper.