Novel Detachable & Flippable Probing Stage for Lock-in Thermography and Laser-based Fault Isolation Tool

In this work, we present a novel detachable & flippable stage with two-point probing that is usable on both top-down lock in thermography and an inverted laser-based fault isolation tool. The flippable probe stage can be used for failure analysis to perform frontside or backside defect localization with a rotating stage. By using this type of stage, defect localization on short or leakage defects in chips can be performed easier to determine whether the defect is in the silicon or in the package substrate when performing lock-in thermography from both sides of the chip. This detachable feature will ease the sample transfer between 2 different fault isolation tools, which generate savings in throughput time (TPT). A detailed discussion on the ease of using this flippable stage in 2 different modes (1) docking on a top-down lock in thermography, and (2) docking on inverted laser-based tool is presented here.