Development of Glass-Based Micro-Patterned Dry Film Bonding for mm-W Device Integration

A micro-patterned dry film (MPDF) bonding method based on an advanced glass packaging process is developed for the fabrication and integration of millimeter-wave (mm-W) devices. Owing to the reduction of contact areas between dry films and substrates, the MPDF achieved by lithography technology can effectively mitigate the formation of voids during traditional adhesive bonding and negative impact of polymers on electrical properties. The dependence of void-free behaviors and electrical properties on various micro patterns is investigated. For demonstration, a V-band glass-based double-sided gap waveguide is fabricated by the proposed MPDF bonding. The measured S-parameters are consistent with the simulated ones. It is verified that the proposed MPDF bonding can deal with complex bonding surfaces and can be successfully applied in the fabrication and integration of mm-W and THz devices.