Advancing Efficiency in Thermal Simulation Algorithms for Chip Packaging

In this paper, the alternating-direction implicit finite-difference time-domain (ADI-FDTD) approach and the hybrid explicit-implicit finite-difference time-domain (HIE-FDTD) approach are introduced as two effective numerical computational techniques to implement heat conduction simulations. The ADI-FDTD and HIE-FDTD approaches' computational precision has been numerically verified using analytical solutions and COMSOL simulations. The techniques ADI-FDTD and HIE-FDTD are used for the thermal simulation of a typical 3D chip package model. The techniques ADI-FDTD and HIE- FDTD have significant advantages with regard to computational effectiveness compared to the general Finite difference time domain method. Since the ADI-FDTD and HIE-FDTD methods show excellent stability, efficiency and applicability to modeling complex structures in the experiments of this paper, they can be widely applied to heat transfer simulations, especially those involving fine structures.