An efficient thermal-stress coupling design method for coaxial through silicon via

In this paper, an efficient thermal-stress coupling design method of coaxial through silicon via (TSV) is developed based on finite element method (FEM), artificial neural network (ANN) model and particle swarm optimization (PSO) algorithm. In order to analyze the effect of design parameters on the thermal-stress distribution of coaxial TSV, the FEM model is simulated by COMSOL. The mapping relationships between the design parameters and performance indexes are described by ANN models based on the simulation data of FEM. In addition, the multi-objective optimization criteria are formulated based on the desired performance indexes, and then the design parameters are optimized by the modified PSO algorithm. Based on the optimized design parameters, the effectiveness of the developed method is validation by FEM simulation. The simulated performance indexes well agree with the desired ones, which implies that the design parameters of coaxial TSV can be effectively optimized to control the thermal-stress distribution. Therefore, the proposed efficient thermal-stress coupling design method of coaxial TSV can achieve the thermal-stress management to improve its reliability.