A Novel Multiphysics Simulation Method for Packaging Analysis of Chips Based on MOOSE

In this paper, we present a fully-coupled electromagnetic-thermal-mechanical multiphysics simulation method for the packaging analysis of chips by overcoming the challenges resulting from the miniaturization of packaging structure and inclusion of thermodynamic and mechanical coupling effects. By using the multiphysics object-oriented simulation environment (MOOSE), we achieve a parallel high-performance simulation which employs a hybrid scheme of combining the finite element method (FEM) and the finite-difference time-domain (FDTD) method to minimize computational costs. Numerical experiments demonstrate that the method has a superior efficiency compared to the COMSOL while it can give a consistent result.