A Comparison of Relative Seebeck Coefficients for Screen Printed Flexible Thermocouples Using Commercially Available Conductive Inks

Thermocouples prepared on flexible substrates using additive manufacturing techniques can provide a path forward to strain independent temperature sensors for applications in a variety of wearable devices. An evaluation of 3 conductive ink pairings (C/ Ag, Ag/Ni, C/Ni) fabricated using a screen-printed process is presented. The relative Seebeck coefficients of each ink pair was measured to be
$9\mu \mathrm{V}/^{\circ}\mathrm{C}+/-2\mu \mathrm{V}$
, 16
$\mu \mathrm{V}/^{\circ}\mathrm{C}+/-2\mu \mathrm{V}$
and
$27\mu \mathrm{V}/^{\circ}\mathrm{C}+/-6\mu \mathrm{V}$
respectively. Response time of the sensors were also evaluated to characterize the capability of real-time measurement with these devices.