Advanced Manufacturing of Flexible Electronic Circuits by Transfer Foil Method

This study presents an advanced method to manufacture large-area flexible electronic circuits in a continuous roll-to-roll process. Transfer foil method founds on converting processes to cut and laminate thin metal foils to designed patterns onto a target substrate. The processing technique utilizes die-cutting tools, carrier foils and adhesive films to embed functionalities with bulk metal level conductivity directly on various surfaces. Transfer foil method is a chemical-free process and operates at room temperature favoring sustainable manufacturing. Furthermore, integration of rigid electronics on transfer foil patterns is realizable by low temperature soldering as proven in the paper.