Redistribution Layer aluminum advanced etching process development

Advanced Package continues to play a major role in the semiconductor industry. Redistribution Layer (RDL) is an important part of today’s advanced packaging, it is the electrical extension and interconnection of X-Y plane. It changes its contact position through wafer level metal wiring process and bump process, and arranges pins to new, more spacious areas, so that IC can be applied to different packaging forms. In the process of RDL plasma etching process tuning, we overcome the bottom CD and OX recess uniformity Worse, double slope and other issues to successfully realize the mass production of RDL on etch machine;