A Novel Model-Matching Based Scratch Tool Tracing System

In semiconductor manufacturing process, wafer will inevitably contact some parts of the process tool and cause mechanical scratches [1], which will affect the yield. In order to identify the process tool that may cause wafer scratches, it is necessary to stop all the process steps that wafer through and conduct scratch tests, thus affecting production line capacity. The paper proposes a novel model-matching based scratch tool tracing system. This system comprehensively consider the scratch pattern of defect map, the common process tool, the matching degree between the contact point of process tool and the scratch position of the wafer, and the wafer through count of the process tool to build an analysis system for automatically checking the process tool that may cause scratches for wafer. Through simulation experiment, this system can effectively screen out the process tool that may cause wafer scratches, improve the efficiency of engineers to check out the process tool may cause scratch, and reduce the number of process tool stopped for scratch test.