Hybrid Substrate With Ultralarge Organic Interposer for Heterogeneous Integration

In this study, the fan-out chip-last panel-level packaging method in fabricating an ultralarge organic interposer of a hybrid substrate for heterogeneous integration is investigated. Emphasis is placed on the design, materials, process, fabrication, and simulation of thermomechanical reliability of a hybrid substrate (
$85\times80$
mm), which consists of an ultralarge organic interposer (four redistribution layers (RDLs) with the minimum metal linewidth (
$L$
) and spacing (
$S$
) = 2
$\mu \text{m}$
), a 5-2-5 build-up package substrate, and Sn0.7Cu solder joints with underfill. Also, some recommendations will be provided.