Verification of Hygrothermal Simulations Using Silicone Encapsulated Climate Sensors in Continuously Operated IGBT Power Modules

This paper presents measurements of temperature and humidity conditions in a power module during continuous pulse-width modulation (PWM) operation. Based on the results, a developed hygrothermal simulation model is validated. This can subsequently be used later to identify critical operating conditions which can create lifetime-reducing microclimates on the chip level. This approach enables the implementation of a condition monitoring system based on the microclimate inside the power module.