Compact Quad-band Filter with Bridged-T Coil Based on Through-Silicon Vias Technology

By using the lumped elements based on the bridged-T coil structure, a quad-band bandpass filter is proposed based on Through-Silicon Via (TSV) technology. By stacking multilayer bridged-T coils in 3D configuration, the proposed filter is minimized to a compact footprint of only 0.4 $\mathrm{mm}^{2}$. With the four passbands of designed at 0.665, 5.2, 10.5 and 35.8 GHz, the simulated results demonstrate a high-selectivity and wide stopband band range (up to 40GHz) performance. The filter has insertion losses less than 0.48 dB@0.665 GHz, 2.48 dB@5.2 GHz, 2.6 dB@10.5 GHz and 2.12 dB@35.8 GHz in the passbands. The suppression levels are better than 38dB in the stopband.