Experimental and Numerical Study of an Oscillating Electrohydrodynamic Conduction Pump

As electronic systems continue to modernize and develop, they get smaller, more complex, and require more power. Therefore, advancements in thermal management mechanisms are necessary to support these systems. Existing thermal management systems typically involve heat pipes or loops to dissipate heat from electronics. While these methods transfer heat effectively, they often are challenged by mechanical deterioration or passive heat transfer methods. Electrohydrodynamic (EHD) conduction pumping is an innovative, low power, and non-mechanical method to pump fluids for thermal management. In addition to these advantages, EHD is also simple in design and is controllable, as it can be integrated into complex and programmable scenarios for optimal thermal management. EHD conduction pumping in unidirectional flows has been successfully explored as a method of enhancing heat transfer and managing fluid flows in both space and terrestrial applications. By designing EHD conduction pumping to oscillate flows, a system is expected to experience further enhanced heat transfer than typical unidirectional pumping due to mixing. This study investigates this novel concept of using EHD conduction pumping to oscillate a liquid film to observe the effects on fluid flow behavior, using Novec 7100 as the working fluid. Through the use of particle image velocimetry (PIV), quantitative fluid flow results are investigated to characterize flow behavior, velocity profiles, and local vortices. Based on the results, which include enhanced vorticity, and pulsating flow, it is expected that this technology can be used to enhance heat transport. A single-phase numerical simulation of the fluid flow behavior under the influence of a bidirection pump is also carried out. The results of this simulation support those found in the experimental study. Both sets of results continue to support the future of EHD conduction pumping as a technology to augment next generation cooling technologies.