Experimental Study of the Temperature Field of an Electronic Module

The thermal performance of electronic modules is of significant importance for their reliability and long service. In the present study is performed experimental investigation of the temperature field of a test module with the aim to obtain different physical parameters of the PCB and then perform thermal simulations. Initially an experimental setup is used, which allows to classify the temperature field of the electronic device into several zones (categories) as a function of time. Thereafter, these experimental results were used to obtain the area of each zone, its temperature response, the heat transfer coefficient, etc. Next, different simulations were performed with the use of a specially developed simulation tool. It allows to investigate the temperature response of the module under different environmental and constructional parameters. The obtained results allow to create an informational database, allowing the simulation of the temperature field of electronic modules.