An Efficient Electrical-Thermal Co-Design Methodology for Analysis of High-Speed PCB Interconnects

This paper reports a novel co-design methodology for signal integrity analysis considering thermal effects. Our analysis focuses on practical high-speed interconnect topologies. To ensure reliable and efficient system design, we introduce an efficient electrical-thermal methodology (EEM) for high-speed PCB interconnects. Using our proposed EEM, we perform electrical-thermal co-simulation to ensure efficient design and performance.