Novel Photosensitive Polyimides Compositions with Low Dielectric Property and Good Flexibility Corresponding to Redistribution Layers for High Speed Transmission Applications

Heterogeneous chiplets integration technologies have evolved with the demand for higher performance from advanced applications, and redistribution layers (RDLs) are one of the critical components for these technologies. The same is true for the polymer materials used in RDLs, which have been required to provide higher mechanical and electrical performance. Here we demonstrate the development of novel photosensitive polyimide compositions with low dielectric properties, good flexibility and good processability with respect to a semi-additive process. We believe that our polyimide compositions are suitable for polymer materials of RDLs to be incorporated in advanced heterogeneous integration packages in the future.