High Performance, Multilayer Copper-Graphene Micro-Foam Wicks for Vapor Chambers

Over the years, the drive for the miniaturization of electronic packages has resulted in continuous thermal densification and increasing intensity and impact of hot spots on thermal reliability. This brings the need for advanced, near-junction heat-spreading solutions beyond the capability of copper thermal pads. Two-phase closed systems like vapor chambers and heat pipes have gained momentum to address this grand challenge. Continuous miniaturization of these advanced thermal structures requires innovation in wick materials. Recent advancements in cooling technologies have introduced two-phase closed systems like vapor chambers to help with thermal dispersion; however, continuous miniaturization requires further development into a wick's structural and material design for vapor chambers to keep up. Copper-graphene composites have emerged as a potential pathway for material innovation in thermal and electrical systems. In this research, stochastic copper foams are used as a backbone for the synthesis of multilayer copper-graphene foams to create a composite of higher thermal capabilities than traditional pure copper. Composite foams of various cell sizes were fabricated and characterized for improvement analysis on the addition of a fully connected graphene structure. Thermal, electrical, surface, and structural analysis is performed to understand how the fabrication of the composite affects both the original copper backbone and the final composite. Multilayer copper-graphene composite foams show promise in advancing thermal management materials for future electronic packaging technologies.