High Density VR Solutions using Immersion Cooling

As data centers increment their power consumption, new thermal solutions have emerged, one of them is immersion cooling technology. Two-phase immersion cooling (2PIC) is a very suitable technology to be used in high density applications which can target power conversion solutions by reducing voltage regulator (VR) devices temperature. In this paper, a cost reduction study decreasing phase count by 25% was tested, understanding impact on performance, efficiency and temperature when using 2PIC technology. Performance of the VR could be affected by reducing the number of phases and thus impacting the output capacitor solution. This challenge can be addressed by using Trans-Inductor Voltage Regulator (TLVR) topology. A TLVR solution was evaluated using traditional air-cooling solution and inside a 2PIC tank in order to compare thermal and electrical performance. Finally, key learnings are shared on 2PIC tank set up and condenser selection to optimize the resources utilized during testing.