A New Vibration Test Method for Automotive and Consumer Electronic Devices: Calibration and Fatigue Test

This paper describes two types of test vehicles including PCB with 77x77mm² and 140x140mm². The first TV is taken from drop test spec (JESD22-B111A) so that the same TV can be shared. Various vibration tests including acceleration and strain calibration have been performed in five (5) different labs (Coded as L1-5) on the same TVs. The vibration tests include sine sweep at 1-4G and random vibration 3.1 to 10Grms. The results show that the correlation of natural frequencies, max acceleration and strain across all test labs are within acceptable limits. Further vibration fatigue tests were also performed using fixed acceleration at sine sweep and random vibration from all those labs. Finite element analysis (FEA) is also employed for board characterization as comparison to the test results. The results show that a reasonable correlation is achieved in terms of natural frequencies, acceleration, and PCB strain. time to failure and failure modes. Various failure modes including solder joint cracking, trace cracking and pad cratering are found. Interestingly, there is a close relationship between cycles to failure and modeling which shall give a clue for predicting severity of vibration fatigue for the system.