Signal Integrity of 2-µm-Pitch RDL Interposer for High-Performance Signal Processing in Chiplet-Based System

Given the demand for advanced I/O interfaces, we have simulated eye diagram of 2-µm-pitch signal/ground lines based on coplanar topology and compared them with those of 4-µm-pitch signal lines based on embedded microstrip topology. Simulation showed that 2-µm-pitch signal/ground lines provide better signal integrity and thus enable high-performance signal transmission to achieve high-performance signal processing in the specification of HBM3 and UCIe1.0.