Same size mold chase technology for effective stack die architectures

In this paper, we have studied the effect of same sized mold chase and multi-pass mold process on the final wafer properties including warpage, edge mold coverage, die yield etc. Previous studies have shown multi-pass molding help enable embedded stacked die architectures. By combining multi-pass mold under controlled warpage with same sized mold chase, we have suggested here a pathway of utilizing mold for stacked die architecture. By utilizing granular resin material, that we previously used for compression molding, we are able to better control the mold coverage at the edges as well as keep warpage low. Controlling the processing conditions helped us bring down the final warpage by up to 25%. We have also shown the reducing impact of multiple pass mold on warpage compared to single pass mold and proposed an example of stacked die architecture which would best utilize this concept.