Thermal Solutions For Large Die and Package

The demand for higher thermal performance package increases and this is exacerbated by the increased of die and packages sizes. The insufficient coverage, interfacial separations, voids, and thicker Bond Line Thickness (BL T) of Thermal Interface Material (TIM1) caused by package materials and assembly processes prevent good thermal performance. Thermal impedance better than 15 mm2-C/W is needed for high-power applications. Lower thermal impedance is better for thermal performance. This work evaluated next generation TIM 1 s with thermal conductivity ranging from 4 to 10 W/m-K, the assembly of these materials with different lid attach processes and their reliability. It allowed Marvell and its OSATs to select the TIM 1 that meets the thermal requirement of large die & package.