Development of Electronic-Photonic 3D System in Package: Architecture, Integration, and Scaling

Next generation computer and storage infrastructure requires a data bandwidth beyond 100-Gbps per module. Current optical modules are discrete and bulky with higher maintenance costs and power consumption. The proposed solution is to co-package distributed Optics and FPGA/ASIC on the same interposer, offering cost-efficient optical interconnects and small-footprint components. This reduces the assembly, testing, and manufacturing costs while increasing throughput. A multi-interposer hexagonal System-in-Package (SiP) called
$\text{LightSiP}^{\text{TM}}$
, is developed integrating optical transceivers and programmable logic devices within a single package. The Interposer-1 consists of two Intel Arria 10 FPGA silicon dies surrounded by twelve optical interconnects, called
$\text{LightKonnect}^{\text{TM}}$
, each supporting 192 Gbps of data bandwidth distributed spatially. Interposer-2 has 32 GB DDRAM, Intel MAX10 as System Controller, and Clock generators. Interposer-3 houses all the power micro modules.
$\text{LightSiP}^{\text{TM}}$
is a small footprint package (F
$< 55$
mm hexagon side) with
$\sim 100\mathrm{W}$
power, 2 x 1519 GFLOPS, and total optical
$\text{I/O}$
of up to 2.4 Terabits for processing computations in near Realtime.