High Modulus Photosensitive Permanent Film Utilizing Novel Polymerization System for Advanced MEMS Structure Fabrication

This paper reports the development of novel high modulus photosensitive permanent dry film material utilizing dual polymerization systems with photocationic and photoinitiated radical polymerization in addition to inorganic filler loading. This new polymerization system enables fast photo-curing and superior lithographic performance while maintaining good physical properties. These characteristics promise to contribute to next generation MEMS packaging, which faces a more miniaturized and complex structure.