Single-Layer Release Material Having Laser Lift-Off and Chip Fixing Property for FO-WLP Chip First Process

Fan Out Wafer Level Package (FO-WLP) and Fan Out Panel Level Package (FO-PLP) device is recently attracted more and more attention and various properties are required for materials. In generally, process cost and management of device warpage are one of the major problem in FO-WLP process. In this paper, we introduce the new laser lift-off material. It can achieve the process cost reduction because of simple single-layer process. This new laser lift-off material has good adhesion with metal and mold material. Therefore delamination of interface of the device and this material is suppressed, even if stacked device warpage become high. It can be expected to applying FO-WLP and FO-PLP chip first process. We also report the unique optimization procedure of chip bonding condition for laser lift-off material with manual chip bonder and bond tester. This method may be able to apply to other chip bonding materials.