Investigation of Different Hot Bar Soldering Modes for Obtaining Strong Solders by Statistical Methods

The article examines and analyzes the results of the conducted research on the strength of solders with electronic assembly type LGA (Land Grid Array) in different modes of soldering with Hot bar technology. Experiments and results obtained to achieve the maximum breaking strength of soldered pads of a flexible printed circuit board (FPC) to a standard rigid printed circuit board (PCB) under various hot bar soldering process parameters are described. The solder used and the machine used are specified. The soldering system of a flexible and rigid circuit board is applied, the design of which is optimized for the specific use. The breaking force measurement system is presented, and the MSA (Measurement System Analysis) method is used for validation. By using the SPC (Statistical Process Control) statistical method, a reliable analysis was made and objective conclusions were generated. An optimum mode for Hot bar soldering has been determined, which results in a stable maximum breaking strength of the solders for a particular application.