An Ultrawideband Transition from Substrate Integrated Suspended Parallel Strip Line to Grounded Coplanar Waveguide

This paper proposes a novel ultrawideband transition between substrate integrated suspended parallel strip line (SISPSL) and grounded coplanar waveguide (GCPW). Such transition serviceably facilitates the integration of different transmission lines on the same multilayer printed circuit board (PCB) structure, which can easily realize functional fusion. The double-sided parallel strip-line (DSPSL) is embedded inside the air cavity of the self-packaging substrate integrated suspended line (SISL) multilayer structure, which can effectively reduce the radiation loss of the circuit with the electromagnetic shielding property of the enclosure. The proposed transition is fabricated using the PCB process, which has the advantages of self-packaging and low cost. The measured return loss is larger than 10 dB from DC to 60 GHz. It provides a guarantee for the circuit packaging and testing of ultrawideband SISPSL.