Probability of Failure due to Electrochemical Migration on Surface Mount Capacitor under Electrolyte Condition with same Contamination and Conductivity Level

The effect of three common no-clean solder flux residues (adipic acid, glutaric acid, and succinic acid) as contamination types at three low levels (same concentrations) as well as in the same conductivity value in comparison with sodium chloride (NaCl) on time to failure (TTF) due to electrochemical migration (ECM) on the surface mount capacitors (SMCs) were investigated. The relation between TTF and leakage current (LC), conductivity, number of failures, as well as the probability of failure (PoF) using applicable probabilistic distributions in various conditions combined with diverse contamination types/levels and voltage based on many replications were studied.