Thermal and Performance Analysis of Back-side Power Delivery Network beyond 3nm Technology Node

In this work, the Back-side Power Delivery Network (BSPDN) based on the NSFET and FINFET standard cell arrays are constructed for the thermal analysis in comparison of front-side power delivery networks (FSPDN). The performance metrics reflecting the IR drop and hotspot temperature are proposed to evaluate the characteristics of BSPDN. The impacts of different activity factors, interconnecting metals and structure ratios are investigated. The results indicate that BSPDN faces the severer thermal challenges than FSPDN after the substrate thinning. And the design guidance of BSPDN is given for improving its performance at advanced node.