Transient Dose Rate Effect Between System-in-Package and Printed Circuit Boards: A Comparative Experimental Study

This article presents a comparative experimental study of the transient dose rate effect (TDRE) between the system-in-package (SiP) SZ0501 and its prototype printed circuit board (PCB). The SiP and prototype board have the same functions, and they can be regarded as complete electronic systems. The same program is applied to both electronic systems in transient gamma-ray experiments. Both the SiP and prototype board are supplied by external dc power analyzers. The operating currents and transient photocurrents are measured. Then, radiation performances of the SiP and prototype board are recorded with increasing dose rates. The experimental results show that the outputs of both systems have similar failure types, while there are significant discrepancies in terms of failure thresholds. In addition, both systems present latch-up effects, but their features are quite different. It is speculated that their power distribution networks (PDNs) are likely to be the main cause of these discrepancies. Experiments also show that using differential structure should be effective in improving the performance of the tested devices. These findings are analyzed and discussed by combining previous experimental results of this SiP.