Thermal Performance of a Liquid-cooling Assisted Thin Wickless Vapor Chamber

The ever-increasing need for power consumption in electronic devices, coupled with the requirement for thinner size, calls for the development of efficient heat spreading components. Vapor chambers (VCs), because of their ability to effectively spread heat over a large area by two-phase heat transfer, seem ideal for such applications. However, creating thin and efficient vapor chambers that work over a wide range of power inputs is a persisting challenge. VCs that use wicks for circulating the phase changing media, suffer from capillary restrictions, dry-out, clogging, increase in size and weight, and can often be costly. Recent developments in wick-free wettability patterned vapor chambers, that replace traditional wicks with laser-fabricated wickless components, hold promise. An experimental setup is developed which allows for fast testing and experimental evaluation of water-charged VCs with liquid-assisted cooling. The sealed chamber can maintain vacuum for long durations, and can be used for testing of very thin wick-free VCs. This work extends our previous study by decreasing the overall thickness of the wick-free VC down to 3 mm and evaluates its performance characteristics. Furthermore, the impact of wettability patterns on VC performance is investigated, by carrying out experiments both in non-patterned and patterned VCs. Experiments are first carried out on a wick-free VC with no wettability patterns and comprising of an entirely superhydrophilic evaporator coupled with a hydrophobic condenser. Thereafter, wettability patterns that aid the rapid return of water to the heated site on the evaporator and improve condensation on the condenser of the vapor chamber are implemented. The thermal characteristics of the VCs are compared, and show that the patterned VCs outperform the non-patterned VCs under all scenarios. The patterned VCs exhibit low thermal resistance independent of fluid charging ratio, while withstanding higher power inputs without thermal dry-outs.